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Figure 4 illustrates the effectiveness of PGS in lowering temperatures at hot spots. It shows the temperatures on the ABS layer (acrylonitrile butadiene styrene) where the IC's contact with the surface is buffered by a silicone thermal pad (type A / type B), as well as in cases where a large (type A-1 / type B-1) or small (type A-2 / type B-2) PGS with a thickness of 70µm is positioned between the silicone layer and PCB. Figure 4 clearly shows that even if just a small sheet is used, the PGS reduces the temperature at the hot spot considerably—even when no silicone thermal pad is used (thereby creating an air gap). PGS also provides a limited level of shielding from electromagnetic interference, allowing it to also be used as a solution for EMC in many applications. This stable material is not sensitive to environmental influences and does not show any signs of aging.

By Nnamdi Anyadike | 16-01-2020

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Effective heat management is a must for practically any electronic device or application. Numerous solutions are available that meet the requirements of today's innovative applications. By Roland Hofmann, Product Manager for Thermal Management at Rutronik.